PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent resolution and adhesiveness and good plating resistance, and to provide a photosensitive element, a method for producing a resist pattern, a method for manufacturing a printed wiring board, and a printed wiring board using the composition.

SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond and (C) a photopolymerization initiator. The (A) component includes (a1) 50 to 80 mass% of a structural unit derived from a benzyl (meth)acrylate derivative, (a2) 5 to 40 mass% of a structural unit derived from a styrene derivative, (a3) 1 to 20 mass% of a structural unit derived from an alkyl (meth)acrylate, and (a4) 5 to 30 mass% of a structural unit derived from a (meth)acrylic acid.

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