POWER MODULE AND POWER CONVERSION APPARATUS USING SAME

摘要

This power module is provided with: a plurality of semiconductor elements which constitute upper and lower arms of an inverter circuit; a plurality of conductor plates disposed to face respective electrode surfaces of the semiconductor elements; and a module case which houses the semiconductor elements and the conductor plates. The module case has: a board-shaped heat dissipating metal member which faces the surfaces of the conductor plates; and a metal frame body having an opening closed by means of the heat dissipating member. At the center of the heat dissipating member, a heat dissipating fin section is provided, said heat dissipating fin section having a plurality of heat dissipating fins provided upright, and on the outer circumferential edge of the heat dissipating member, connecting portion with the frame body is provided. The heat dissipating member has heat conductivity higher than that of the frame body, and the frame body has rigidity higher than that of the heat dissipating member.