| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode assembly mounted on a plating apparatus repeatedly and stably forming a plating film having excellently uniform film thickness distribution and composition distribution. SOLUTION: The cathode electrode assembly 1D is formed by arranging an auxiliary electrode in the vicinity of a material 4 to be plated connected to a main electrode. The auxiliary electrode has an electrode plate 6 provided with a plurality of recessed parts 61 on the exposed own surface. The electrode plate 6 has an opening 1K and the material 4 to be plated arranged on a position corresponding to the open 1K. The electrode plate 6 functions as a structure capable of preventing the expansion of the surface area of the plating film formed so as to cover the own exposed surface, the expansion being caused by the progress of the plating treatment. As a result, the electrode plate 6 forms the stable electric field distribution without changing over time around the material 4 to be plated. COPYRIGHT: (C)2010,JPO&INPIT |
