| 摘要 |
A joining apparatus is provided to apply a laser beam to a joint interface between two members to be joined. The joining apparatus includes a laser-applying unit for applying a continuous wave laser beam with a focal point thereof spaced a predetermined distance away from the laser light absorbent layer; and a retainer including a pressing portion for applying in a compressing direction a substantially uniform surface pressure to the entire contact surfaces of the two members to be joined at the time of applying the laser beam. |
