| 摘要 |
The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4≦̸[Ni+Co]/Si≦̸about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5≦̸Ni/Co≦̸about 2. |
