发明名称 LASER PROCESSING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser processing device that can avoid the influence of the matters scattered from a workpiece, thereby accurately detecting a position of a laser beam relative to a processing nozzle. <P>SOLUTION: The laser processing device includes: a processing head 5 having a hollow housing; a processing lens 4 provided inside the processing head 5 and condensing the laser beam 2 to irradiate the laser beam toward the workpiece W; the processing nozzle 11 provided at an end of the processing head 5 and feeding an assist gas along a traveling direction of the condensed laser beam 2; and an optical sensor 6 provided inside the processing head 5 and receiving the light generated in a processed part of the workpiece via the processing lens 4. The optical sensor 6 is disposed so as to receive the light reflected once or more times at one or both of the inner surfaces of the processing nozzle 11 and the processing head 5, out of the light generated in the processed part of the workpiece W. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012223772(A) 申请公布日期 2012.11.15
申请号 JP20110090556 申请日期 2011.04.15
申请人 MITSUBISHI ELECTRIC CORP 发明人 MATSUZAWA SUGURU;KONO HIROYUKI;SEGUCHI MASAKI;FUKUOKA TERUAKI
分类号 B23K26/00;B23K26/04;B23K26/06;B23K26/14 主分类号 B23K26/00
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