EPOXY RESIN COMPOSITION FOR LED SEALANT, LED DEVICE, AND METHOD FOR MANUFACTURING THE LED DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for an LED sealant which is transparent and excellent in light resistance and thermal yellowing resistance, an LED device sealed with the composition, and a method for manufacturing the LED device.

SOLUTION: The epoxy resin composition for an LED sealant includes (A) a glycidyl ether compound and (B) an acid anhydride curing agent or a cationic polymerization initiator and does not substantially include a compound containing a carbon-chlorine bond within a molecule. The LED device is sealed with the epoxy resin composition. The method for manufacturing the LED device includes a step of sealing an LED chip with the epoxy resin composition.

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