发明名称 INSPECTION METHOD OF EUV MASK BLANK, MANUFACTURING METHOD OF EUV PHOTOMASK, AND PATTERNING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an inspection method for inspecting a micro phase defect in an EUV mask blank simply with high sensitivity. <P>SOLUTION: In an EUV exposure apparatus having a reflective optical system, an EUV mask blank having a chip pattern and a substrate, on which a lower layer film, an intermediate layer film and a negative resist film are formed, are installed. After transferring a chip pattern to the negative resist film by EUV light exposure, the chip pattern is transferred by etching the intermediate layer film by using the negative resist film as a mask, and then the chip pattern is transferred by etching the lower layer film by using the intermediate layer film as a mask. Defect of the EUV mask blank is detected by comparing the chip patterns transferred to regions of the lower layer film at more than one place. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012186373(A) 申请公布日期 2012.09.27
申请号 JP20110049240 申请日期 2011.03.07
申请人 PANASONIC CORP 发明人 IRIE SHIGEO
分类号 H01L21/027;G03F1/22 主分类号 H01L21/027
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