发明名称 |
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR DEVICE, AND RELEASE AGENT |
摘要 |
Disclosed is an epoxy resin composition used for encapsulation of a semiconductor containing an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a mold releasing agent, in which the mold releasing agent contains a compound (D) having a copolymer of an α-olefin having 28 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic alcohol having 10 to 25 carbon atoms. |
申请公布号 |
KR20120099044(A) |
申请公布日期 |
2012.09.06 |
申请号 |
KR20127012878 |
申请日期 |
2010.10.07 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
TABEI JUNICHI |
分类号 |
C08L63/00;C08K3/00;C08L23/26;H01L23/29 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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