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发明名称
Apparatus for molding a semiconductor package
摘要
申请公布号
KR101173092(B1)
申请公布日期
2012.08.10
申请号
KR20100055512
申请日期
2010.06.11
申请人
发明人
分类号
H01L23/02
主分类号
H01L23/02
代理机构
代理人
主权项
地址
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