发明名称 Low Temperature Curable Adhesive Compositions
摘要 The present invention is concerned with curable adhesive compositions for anchoring elements in a structural body that exhibit low temperature versus standard temperature degree of cures that are at least 50% or higher. The compositions include, in a first component, a reactive resin, an acetoacetoxy functional monomer and a silane monomer. By using phthalate-free constituents in the formulation, a further 10% increase in strength and durability of the resins at standard temperatures may be realized after curing at low temperatures.
申请公布号 US2012184681(A1) 申请公布日期 2012.07.19
申请号 US201113007635 申请日期 2011.01.16
申请人 HIBBEN QUENTIN LEWIS;SIMPSON STRONG-TIE COMPANY, INC. 发明人 HIBBEN QUENTIN LEWIS
分类号 C08L83/00;C08F30/04 主分类号 C08L83/00
代理机构 代理人
主权项
地址