ADHESIVE TAPE FOR SEMICONDUCTOR DEVICE DICING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE CHIP

摘要

PROBLEM TO BE SOLVED: To provide an adhesive tape for semiconductor device dicing in which attachment of fibrous cut wastes during a dicing process is reduced and adherence of an adhesive is also reduced in a part around a semiconductor device laser mark, and a manufacturing method of a semiconductor device chip using the adhesive tape.

SOLUTION: The present invention relates to an adhesive tape 100 for semiconductor device dicing in which an adhesive layer 20 is formed on a base material resin film 10. Resin composition constituting the base material resin film 10 contacting the adhesive layer 20 has a base resin component of an ethylene vinyl acetate copolymer which has melt flow rate of 1 to 20 as well as weight average molecular weight of 150000 to 600000.

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