| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique capable of suppressing performance variations for each flow rate sensor. <P>SOLUTION: The flow rate sensor has a structure in which a part of a semiconductor chip CHP 1 is covered with resin MR in a state where a flow rate detection part FDU formed in the semiconductor chip CHP 1 is exposed. The height of the upper surface SUR (MR) of the resin MR is higher than the upper surface SUR (CHP) of the semiconductor chip CHP 1 to stabilize an air flow in the flow rate detection part FDU because a part of an upper surface SUR (CHP) of the semiconductor chip CHP 1 is sealed with resin MR in a direction parallel to an air flow direction. In addition, interface peeling between the semiconductor chip CHP 1 and the resin MR can be prevented due to an increase in a contact area between the semiconductor chip CHP 1 and the resin MR. <P>COPYRIGHT: (C)2012,JPO&INPIT |
