SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGING METHODS WITH LIQUID INJECTION MOLDING, AND MOLDED SEMICONDUCTOR LIGHT EMITTING DEVICE RIBBON

摘要

PROBLEM TO BE SOLVED: To provide semiconductor light emitting device packaging methods including a process of fabricating a substrate configured to mount a semiconductor light emitting device thereon.

SOLUTION: Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.

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