| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminate and print circuit board that can achieve high thermal conductivity while maintaining strength, and can secure insulation reliability. <P>SOLUTION: The laminate is obtained by sticking metal foils on a topmost layer and heating and molding, in which configuration a prepreg is sandwiched with resin sheets, or the plurality of configurations are laminated. The prepreg is a prepreg obtained by impregnating a glass substrate with a thermal curing resin, and there is a portion that is not filled with a resin in a gap of a warp thread and weft thread of the glass substrate. The resin sheet is a high thermal conductive resin sheet where the resin sheet is formed by applying and drying a filler high-filling resin including an inorganic filler of 60-95 mass% in the thermal curing resin on the metal foil or an organic film. <P>COPYRIGHT: (C)2012,JPO&INPIT |
