发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION MATERIAL AND PATTERN FORMATION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of reducing a developing time and obtaining an excellent pattern shape. <P>SOLUTION: A photosensitive resin composition contains a polyimide precursor including a structure represented by the following formula (1) and a photobase generator. (In the formula (1), R1 is a tetravalent organic group, R2 is a bivalent organic group, R3 is a hydrogen atom or univalent organic group, R4 is a hydrogen atom or at least one kind of organic group selected from the group consisting of organic groups of specific structure, and at least a part of R4 is an organic group. The plural R1, R2, R3, and R4 may be all the same or different from each other. ) <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012093746(A) 申请公布日期 2012.05.17
申请号 JP20110217212 申请日期 2011.09.30
申请人 DAINIPPON PRINTING CO LTD 发明人 AMAGAI KEI;SAKAYORI KATSUYA;TAKACHI KIYOHIRO;FUKUDA TOSHIHARU
分类号 G03F7/038;C08G73/10;G03F7/004 主分类号 G03F7/038
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