发明名称 |
METHOD AND ARRANGEMENT FOR ATTACHING A CHIP TO A PRINTED CONDUCTIVE SURFACE |
摘要 |
A chip (201) is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip (205, 206). |
申请公布号 |
WO2012049352(A1) |
申请公布日期 |
2012.04.19 |
申请号 |
WO2010FI50797 |
申请日期 |
2010.10.14 |
申请人 |
STORA ENSO OYJ;MAIJALA, JUHA;SIRVIOE, PETRI |
发明人 |
MAIJALA, JUHA;SIRVIOE, PETRI |
分类号 |
H05K3/32;B23K20/02;B23K20/04;H05K13/04 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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