发明名称 ELECTROCONDUCTIVE PASTE AND FABRICATING METHOD THE SAME
摘要 PURPOSE: A conductive paste and a manufacturing method thereof capable are provided to prevent excessive contraction generated during a sintering process, reduction of circuit wiring thickness, and crack generation. CONSTITUTION: A conductive paste comprises metallic nanopowders, and metallic nanorods having higher aspect ratio than the metal nano powder. A manufacturing method of conductive paste comprises the following steps: manufacturing conductive compound powder which includes metal nano powder and metal nano bar having higher aspect ratio than the metal nano powder(S202); manufacturing a mixture by adding binder and glass frit to organic solvent(S204); manufacturing conductive paste by adding conductive compound powder to the mixture(S206); and stirring the mixture(S208).
申请公布号 KR20120022217(A) 申请公布日期 2012.03.12
申请号 KR20100085540 申请日期 2010.09.01
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, YOUNG IL;KIM, SEONG JIN;KIM, DONG HOON;KIM, SUNG EUN
分类号 H01B1/02;H01B1/22;H01B5/02 主分类号 H01B1/02
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