发明名称 |
ELECTROCONDUCTIVE PASTE AND FABRICATING METHOD THE SAME |
摘要 |
PURPOSE: A conductive paste and a manufacturing method thereof capable are provided to prevent excessive contraction generated during a sintering process, reduction of circuit wiring thickness, and crack generation. CONSTITUTION: A conductive paste comprises metallic nanopowders, and metallic nanorods having higher aspect ratio than the metal nano powder. A manufacturing method of conductive paste comprises the following steps: manufacturing conductive compound powder which includes metal nano powder and metal nano bar having higher aspect ratio than the metal nano powder(S202); manufacturing a mixture by adding binder and glass frit to organic solvent(S204); manufacturing conductive paste by adding conductive compound powder to the mixture(S206); and stirring the mixture(S208).
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申请公布号 |
KR20120022217(A) |
申请公布日期 |
2012.03.12 |
申请号 |
KR20100085540 |
申请日期 |
2010.09.01 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, YOUNG IL;KIM, SEONG JIN;KIM, DONG HOON;KIM, SUNG EUN |
分类号 |
H01B1/02;H01B1/22;H01B5/02 |
主分类号 |
H01B1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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