发明名称 |
Substrate processing method and substrate processing apparatus |
摘要 |
Disclosed is a substrate processing method wherein the infrared absorptance or infrared transmittance of a substrate to be processed is measured in advance, and the substrate is processed according to the measured value while independently controlling temperatures at least in a first region located in the central part of the substrate and in a second region around the first region using temperature control means which are respectively provided for the first region and the second region and can be controlled independently from each other. |
申请公布号 |
US8124168(B2) |
申请公布日期 |
2012.02.28 |
申请号 |
US20060667945 |
申请日期 |
2006.04.04 |
申请人 |
TADA KUNIHIRO;MIYASHITA HIROYUKI;GUNJI ISAO;TOKYO ELECTRON LIMITED |
发明人 |
TADA KUNIHIRO;MIYASHITA HIROYUKI;GUNJI ISAO |
分类号 |
C23C16/46 |
主分类号 |
C23C16/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|