| 摘要 |
A package is made of a transparent substrate (12) having an interferometric modulator (10) and a back plate (30). A non-hermetic seal (32) joins the back plate to the substrate to form a package, and a desiccant (34) resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package. |
