发明名称 CURRENT SENSOR STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To ease stress generated on a core accompanied with the expansion and contraction of a case, and to simply and certainly prevent the deformation of the core. <P>SOLUTION: In a current sensor structure 1, a non-magnetic metallic plate 14 is disposed along an inner surface 3a of a wall portion 3 of an insulation case 2, and a magnetic core 13 is disposed so as to overlap the metallic plate. The metallic plate 14 is interposed between the wall portion 3 and the core. The wall portion 3 and the metallic plate 14, and the metallic plate and the core 13 are bonded by a mold agent 17 filled in the case. The metallic plate 14 absorbs the expansion and contraction of the wall portion 3 to ease a stress load on the core 13. The width of the metallic plate 14 is formed to be equal to or wider than the width of the core 13. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012037351(A) 申请公布日期 2012.02.23
申请号 JP20100177049 申请日期 2010.08.06
申请人 YAZAKI CORP 发明人
分类号 G01R15/20 主分类号 G01R15/20
代理机构 代理人
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