发明名称 |
Light-emitting diode module and manufacturing method thereof |
摘要 |
A method for manufacturing a light-emitting diode (LED) module is provided. Plural LED package structures are formed on a substrate first. A space is located between two adjacent LED package structures. A Lens laminated plate is subsequently bonded onto the LED package structures. The lens laminated plate includes plural lenses, and each lens is located right above a LED of each LED package structure. Finally, plural LED modules are formed by cutting the substrate along the space. A LED module structure is also disclosed. |
申请公布号 |
US8110842(B2) |
申请公布日期 |
2012.02.07 |
申请号 |
US20070827475 |
申请日期 |
2007.07.12 |
申请人 |
WENG SSU-YUAN;EVERLIGHT ELECTRONICS CO., LTD. |
发明人 |
WENG SSU-YUAN |
分类号 |
H01L33/00;H01L33/56;H01L33/58;H01L33/60 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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