| 摘要 |
A semiconductor apparatus and a light emitting apparatus which are capable of efficiently dissipating the heat generated by a semiconductor device and have high reliability, and a method for manufacturing the same are provided. The light emitting apparatus comprises a light emitting device, a heat dissipating member that has an upper surface and a lower surface and supports the light emitting device mounted on the upper surface, first and second leads and an insulating resin that holds the first and second leads at positions isolated from the heat dissipating member, wherein an inner lead of the first lead and an inner lead of the second lead are held at positions lower than the upper surface and higher than the lower surface.
|
