发明名称 METHOD FOR MANUFACTURING SPUTTERING TARGET
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a sputtering target, which is capable of surely positioning a target material and a backing plate by a simple structure to thereby enable continuous bonding. <P>SOLUTION: A weight 5 having a holding part which, when the weight 5 is put over a target material 3 and a backing plate 2 kept in a superposed state, positions and holds them is made ready for use. The target material 3 and the backing plate 2 are superposed on each other while a sheet-like bonding material 4 is sandwiched between their bonding surfaces 2a and 3a. The weight 5 is put over them to position and hold them in a superposed state by the holding part of the weight 5. By passing them in the positioned and held state through a heating furnace, the bonding material 4 is fused, and then the bonding material 4 is solidified while they are kept in the positioned and held state. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011256448(A) 申请公布日期 2011.12.22
申请号 JP20100133351 申请日期 2010.06.10
申请人 MITSUBISHI MATERIALS CORP 发明人 NAGAO MASAYOSHI;ONISHI YASUKI
分类号 C23C14/34 主分类号 C23C14/34
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