| 摘要 |
<p>A temporary adhesive for which temporary adhesion is simple and subsequent detachment is also simple, meaning productivity can be improved. Also, a method of producing a thin wafer that uses the temporary adhesive. The temporary adhesive composition comprises:
(A) an organopolysiloxane comprising:
(I) 40 to 99 mol% of siloxane units represented by R 1 SiO 3/2 (T units),
(II) 0 to 49 mol% of siloxane units represented by R 2 R 3 SiO 2/2 units (D units) and
(III) 1 to 25 mol% of siloxane units represented by R 4 R 5 R 6 SiO 1/2 units (M units) (wherein each of R 1 to R 6 represents an unsubstituted or substituted monovalent hydrocarbon group of 1 to 10 carbon atoms),
and having a weight-average molecular weight exceeding 2,000, and
(B) an organic solvent having a boiling point of not more than 220°C.</p> |
