发明名称 SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide, in a semiconductor device including a plurality kinds of mounting components such as a power semiconductor, a diode, and a terminal, the semiconductor device that achieves a uniform temperature of each component. <P>SOLUTION: The semiconductor device comprises a power semiconductor array 6 and a diode array 7. The resistance value between an emitter electrode and a collector electrode of a power semiconductor 11B at an ON state is larger than that of a power semiconductor 11A and a power semiconductor 11C. The resistance value of a diode 12B when a voltage over a threshold voltage is applied is larger than that of a diode 12A and a diode 12C when a voltage over a threshold voltage is applied. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011243847(A) 申请公布日期 2011.12.01
申请号 JP20100116226 申请日期 2010.05.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 UEMURA HITOSHI
分类号 H01L25/07;H01L25/18 主分类号 H01L25/07
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