Light-emitting device

摘要

A light-emitting device has a light-emitting diode embedded in a resin encapsulant. The resin encapsulant is obtained by curing a curable composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups in the molecule and a perfluoropolyether structure in the backbone, (B) a fluorinated organohydrogensiloxane having at least two SiH groups in the molecule, (C) a platinum group metal catalyst, and (D) a silica powder. The light-emitting device maintains an emission capability without a loss of intensity even in the presence of corrosive sulfur compound and nitrogen oxide gases.