发明名称 Monitoring and repair method for adhesive bonding
摘要 A method for monitoring the presence of an adhesive between two metal workpieces includes measuring the depth of indentation made by electric resistance weld electrodes by measuring the advance of the weld electrodes, and comparing the measured depth of indentation with the depth of indentation that is known to occur when the presence of the adhesive between the metal workpieces minimizes the shunting of weld current and thereby affects the depth of indentation. If the adhesive is absent, a supplemental electric resistance weld is made to compensate for the absent adhesive. The invention is applicable to both adhesive bonding, where only adhesive is used to attach the workpieces, and weldbonding, where an electric resistance weld is made atop a layer of adhesive.
申请公布号 US8053698(B2) 申请公布日期 2011.11.08
申请号 US20070947888 申请日期 2007.11.30
申请人 GM GLOBAL TECHNOLOGY OPERATIONS LLC 发明人 WANG PEI-CHUNG;FICKES JOHN D.
分类号 B23K11/00;B23K11/10 主分类号 B23K11/00
代理机构 代理人
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