| 摘要 |
<p>Disclosed is a thermosetting resin composition capable of realizing a cured material which has good storage stability and resolution and also has good flex resistance, coat hardness, and electrical insulation. Also disclosed are a cured material of the thermosetting resin composition and a printed wiring board using the cured material. The thermosetting resin composition comprises (A) a solid epoxy resin having a structure of general formula (i), (B) an acid anhydride curing agent, (C) a curing accelerator, and (D) a powdered urethane resin. The amount of an acid anhydride in the acid anhydride curing agent is within a range of 0.5 to 1.5 equivalent per equivalent of an epoxy group contained in the solid epoxy resin. In formula (i), X represents -CH2- or -C(CH3)2-, Y represents a group of formula (I) or (II), Z represents a hydrogen atom or a glycidyl group, and n represents an integer of 1 to 12.</p> |
