| 摘要 |
PROBLEM TO BE SOLVED: To increase long-lasting connection reliability to improve electro-migration resistance in a semiconductor package. SOLUTION: An electrode pad of a semiconductor element 1 is connected with an electrode pad 20 on a substrate 21 with a solder ball. The solder ball is constituted of a metal core part 11, and a solder part 10 which is disposed around the metal core part 11 and is lower that the core part 11 in rigidity and melting point. The solder ball is connected with the semiconductor element 1 by reflow. Then, the semiconductor element 1 with the solder ball attached is ultrasonic-connected with the substrate 21, and a metal core 11 is directly connected with an electrode 20 on the substrate 21 side, thereby attaining connection reduced in thermal stress and resistance. COPYRIGHT: (C)2011,JPO&INPIT |
