MULTIPLE SURFACE FINISHES FOR MICROELECTRONIC PACKAGE SUBSTRATES
摘要
Multiple surface finishes are applied to a substrate for a microelectronics package by applying a first surface finish to connection pads of a first area of the substrate masking the first area of the substrate without masking a second area of the substrate, applying a second different surface finish to connection pads of the second area of the substrate, and removing the mask.
申请公布号
WO2011087591(A2)
申请公布日期
2011.07.21
申请号
WO2010US58239
申请日期
2010.11.29
申请人
INTEL CORPORATION;WU, TAO;GURUMURTHY, CHARAVANAKUMARA;OLMEDO, REYNALDO A.
发明人
WU, TAO;GURUMURTHY, CHARAVANAKUMARA;OLMEDO, REYNALDO A.