| 摘要 |
A semiconductor chip is disposed on a first surface of a mounting board with its active surface upward. An inductor is provided at the active surface side, that is, at the surface side of the semiconductor chip not facing the mounting board in order to perform communication between the semiconductor chip and the outside. A sealing resin layer is formed on the first surface of the mounting board in order to seal the semiconductor chip. In addition, a recess or an opening (in the present embodiment, a recess) is provided in the sealing resin layer. The recess includes the inductor thereinside when seen in a plan view.
|
