| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a pressure-welded semiconductor device such that a semiconductor element can be positioned inexpensively during manufacture, and to provide a method of producing the same. <P>SOLUTION: The semiconductor device is produced by fixing positions of the semiconductor element and a metal lead frame with resin while positioning the semiconductor element using the metal lead frame, and then removing a lead frame portion used to position the semiconductor element. At this time, the lead frame and resin are fixed by engagement to eliminate the need for adhesive strength between the resin and lead frame. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
