| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component, the method preventing intrusion of moisture such as a plating liquid into an element assembly and preventing mounting failure and an increase in product size of the electronic component, thereby improving the reliability of the electronic component; and to provide the electronic component. SOLUTION: In the method of manufacturing the electronic component 1, after a first paste layer 16 formed by applying a conductive paste onto end surfaces 2a, 2b of the element assembly 2 by screen printing to form a printed electrode 16a, a second paste layer 17 formed by dipping process is printed to cover the printed electrode 16a to form external electrodes 3, 4, whereby an increase in outline size of the electronic component 1 and generation of mounting failure when mounting can be prevented. In addition, when plating, the intrusion of moisture such as the plating liquid into the element assembly 2 through a part near the boundary between a first region 2A and a second region 2B of the element assembly 2 can be prevented, thereby improving the reliability of the electronic component 1. COPYRIGHT: (C)2011,JPO&INPIT
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