METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor package that has high connection reliability between a semiconductor chip and a wiring structure and can reduce void formation.

SOLUTION: The method of manufacturing the semiconductor package includes: a first step of forming an insulating layer which is made of a photosensitive material and is in a half-cured state on a support; a second step of forming an opening for exposing the support in the insulating layer by a photolithography method; a third step of arranging the semiconductor chip on the insulating layer so that an electrode of the semiconductor chip is positioned at the opening, and curing the insulating layer; a fourth step of forming a sealing resin for sealing the semiconductor chip on a surface of the insulating layer on the side of the semiconductor chip; a fifth step of removing the support; and a sixth step of providing a wiring layer electrically connecting with the electrode exposed in the opening on a surface of the insulating layer on the opposite side from the semiconductor chip to form the wiring structure including the insulating layer and wiring layer.

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