| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting and polishing device capable of efficiently cutting a rectangular substrate into rods and polishing for rods, and capable of forming a cut surface in a slope. SOLUTION: The cutting and polishing device includes a holding table mechanism for holding the rectangular substrate and a machining means equipped with a tool 54 including a cutting blade 542 for cutting the rectangular substrate along expected split lines and a polishing wheel 543 for polishing the cut surface. The holding table mechanism includes a supporting base and a holding surface for supporting the substrate. A feeding tool for mounting the rectangular substrate onto the holding surface while it is joined via wax on one of end surfaces of the rectangular substrate, a tool feeding means, a suck-to-hold means for sucking to hold the rectangular substrate joined with the feeding tool which has been fed out, and a pressing means for pressing the feeding tool against the holding surface to regulate motion of the feeding tool are provided on the holding table. The machining means includes a tool angle adjusting mechanism 7 for operating so that the polishing surface of the polishing wheel 543 constituting the compound tool 54 is inclined with respect to a cutting and feeding direction. COPYRIGHT: (C)2011,JPO&INPIT |
