| 摘要 |
A method for cleaning a wafer stage is provided. First, a wafer stage with a wafer thereon is provided. Second, a leveling scanning step is carried out to examine the evenness of the wafer. The wafer is removed from the wafer stage once an abnormal evenness is detected. Afterwards, a vacuum cleaner device is used to in-situ clean the surface of the wafer stage after the wafer is removed.
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