| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg for buildup that can suppress exposure of a base material by suppressing dissolution of an insulating resin layer exposed on an inner peripheral surface of a via hole during desmear processing, and also secure continuity reliability by suppressing remaining of a resin between a conductor circuit of an inner-layer circuit board on a bottom surface of the via hole and plating in the via hole, and a multilayer printed wiring board using the same. SOLUTION: The prepreg for buildup includes a low-solubility resin layer containing the base material in a low-solubility resin in a B stage which is low in solubility in chemicals during the desmear processing and a high-solubility resin layer provided on one surface of the low-solubility resin layer and composed of a high-solubility resin in the B stage relatively higher in solubility in the chemicals during the desmear processing than the low-solubility resin. COPYRIGHT: (C)2011,JPO&INPIT |
