发明名称 HEAT TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment device obtaining a high temperature-rising speed by combining resistance heating with electromagnetic wave heating. SOLUTION: The heat treatment device for heat-treating a treated object includes a metal treatment container 4 configured to be exhausted, a placing stage 32 having a resistance heating heater part 36 and formed to place the treated object on its upper surface, a gas introducing means 14 introducing gas into the treatment container, an electromagnetic wave introducing means 50 introducing electromagnetic waves into the treatment container, and a device control part 58 controlling the entire device, thereby using heating by resistance heating by the resistance heating heater part disposed on the placing stage in combination with heating by the treated object itself with the electromagnetic waves introduced by the electromagnetic wave introducing means. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011077065(A) 申请公布日期 2011.04.14
申请号 JP20090223673 申请日期 2009.09.29
申请人 TOKYO ELECTRON LTD 发明人 SHIMIZU MASAHIRO
分类号 H01L21/324;C23C16/46;H01L21/205;H01L21/31 主分类号 H01L21/324
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