| 摘要 |
A dry film includes a first solder resist film, a second solder resist film and a supporting film. The first solder resist film includes first particles of first elastomer. The supporting film supports the first solder resist film and the second solder resist film. Adhesion strength of a surface of the second solder resist film is weaker than adhesion strength of a surface of the first solder resist film at a glass transition point of the first elastomer. According to the dry film, it is possible to form a wiring board including a solder resist film which is arranged at a surface of the wiring board and hard to be adhered to a body such as a die upon heating.
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