发明名称 Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag
摘要 An electronic circuit having at least one electronic component comprised of an organic material, and arranged between at least two layers forming a barrier, wherein the layers protect the at least one component against an influence of light, air or liquid.
申请公布号 US7875975(B2) 申请公布日期 2011.01.25
申请号 US20030344926 申请日期 2003.07.25
申请人 POLYIC GMBH & CO. KG 发明人 BERNDS ADOLF;CLEMENS WOLFGANG;FIX WALTER;ROST HENNING
分类号 H01L23/29;G06K19/07;G06K19/077;H01L23/31;H01L23/538;H01L25/04;H01L51/00;H01L51/40;H01L51/52 主分类号 H01L23/29
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