发明名称 |
Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag |
摘要 |
An electronic circuit having at least one electronic component comprised of an organic material, and arranged between at least two layers forming a barrier, wherein the layers protect the at least one component against an influence of light, air or liquid.
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申请公布号 |
US7875975(B2) |
申请公布日期 |
2011.01.25 |
申请号 |
US20030344926 |
申请日期 |
2003.07.25 |
申请人 |
POLYIC GMBH & CO. KG |
发明人 |
BERNDS ADOLF;CLEMENS WOLFGANG;FIX WALTER;ROST HENNING |
分类号 |
H01L23/29;G06K19/07;G06K19/077;H01L23/31;H01L23/538;H01L25/04;H01L51/00;H01L51/40;H01L51/52 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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