发明名称 |
ENSEMBLE MULTICOMPOSANT BLINDE A MONTAGE EN SURFACE |
摘要 |
A surface-mounted shielded multicomponent assembly, comprising a wafer on which several electronic components are assembled; an insulating layer conformally deposited on the structure with a thickness smaller than the height of the electronic components, comprising at least one opening emerging on a contact of said wafer; a conductive shielding layer covering the insulating layer and said at least one opening; and a resin layer covering the conductive layer. |
申请公布号 |
FR2940588(B1) |
申请公布日期 |
2011.01.07 |
申请号 |
FR20080058844 |
申请日期 |
2008.12.19 |
申请人 |
STMICROELECTRONICS (GRENOBLE) SAS |
发明人 |
COFFY ROMAIN;SAUTY JEAN FRANCOIS |
分类号 |
H05K9/00;H05K5/04 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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