发明名称 Plating, chemical plating technique using partial chemical oxidation for aluminum or aluminum copper radiator
摘要 This invention involves the technological field of electroplating, chemical plating, specially involves a method for partially plating aluminum and aluminum copper radiators. A radiator is conducted partial chemical oxidation and enclosure before undergoing galvanization. Firstly oxidize the non-plate surface of the radiator by chemical oxidation, then utilize a sealing compound to fill up tiny holes of the porous layer to make a film thereon against the erosion of acid and alkali, and then process common chemical plating or electroplating. Only plate a weldable nickel-phosphorus alloy on the touching parts at where the aluminum radiator or the aluminums and copper radiator connect with the main frame.
申请公布号 US7833403(B2) 申请公布日期 2010.11.16
申请号 US20070873327 申请日期 2007.10.16
申请人 TWD METAL PRODUCTION CO., LTD. 发明人 XIE WENZHEN;LI DONGLIN
分类号 C23C28/00;C25D5/10;C25D5/12;C25D5/44;C25D5/48;C25D5/50;C25D11/04 主分类号 C23C28/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利