发明名称 |
Plating, chemical plating technique using partial chemical oxidation for aluminum or aluminum copper radiator |
摘要 |
This invention involves the technological field of electroplating, chemical plating, specially involves a method for partially plating aluminum and aluminum copper radiators. A radiator is conducted partial chemical oxidation and enclosure before undergoing galvanization. Firstly oxidize the non-plate surface of the radiator by chemical oxidation, then utilize a sealing compound to fill up tiny holes of the porous layer to make a film thereon against the erosion of acid and alkali, and then process common chemical plating or electroplating. Only plate a weldable nickel-phosphorus alloy on the touching parts at where the aluminum radiator or the aluminums and copper radiator connect with the main frame.
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申请公布号 |
US7833403(B2) |
申请公布日期 |
2010.11.16 |
申请号 |
US20070873327 |
申请日期 |
2007.10.16 |
申请人 |
TWD METAL PRODUCTION CO., LTD. |
发明人 |
XIE WENZHEN;LI DONGLIN |
分类号 |
C23C28/00;C25D5/10;C25D5/12;C25D5/44;C25D5/48;C25D5/50;C25D11/04 |
主分类号 |
C23C28/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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