| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible laminated board that improves heat resistance of a flexible laminated board and suppresses peeling-off of a metal foil from an insulating layer under high temperature. SOLUTION: A metal foil 2 is overlappingly thermocompression-bonded to the outer surface of an insulating film 3. The metal foil 2 is configured such that an average interval Sm between concavities and convexities, specified by JIS B0601-1994, on the face overlapped with the other surface of the insulating film 3 is in the range of 2-5μm and a value of a ratio Sm/Rz between the Sm and the 10-point average roughness Rz, specified by JIS B0601-1994, is in the range of 0.1-2. Consequently, it suppresses generation of a clearance between the insulating film 3 and the metal foil 2 during the thermocompression bonding of both of them. It prevents moisture from entering between an insulating layer, composed of the insulating film 3, and the metal foil 2, thereby suppressing peeling-off of the metal foil 2 from the insulating layer, due to moisture absorption by the insulating layer 4 under high temperature. COPYRIGHT: (C)2011,JPO&INPIT |
