发明名称 |
Semiconductor Chip Package with Undermount Passive Devices |
摘要 |
Various semiconductor chip packages with undermounted passive devices and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a first side of a carrier substrate where the carrier substrate includes a second side opposite the first side. At least one passive device is coupled to the second side of the carrier substrate. The at least one passive device includes at least one first terminal electrically coupled to the semiconductor chip and at least one second terminal adapted to couple to a printed circuit board.
|
申请公布号 |
US2010265682(A1) |
申请公布日期 |
2010.10.21 |
申请号 |
US20090427133 |
申请日期 |
2009.04.21 |
申请人 |
MARTINEZ LIANE;MCLELLAN NEIL;LEUNG SILQUN;WONG GABRIEL |
发明人 |
MARTINEZ LIANE;MCLELLAN NEIL;LEUNG SILQUN;WONG GABRIEL |
分类号 |
H05K7/00;H05K3/30 |
主分类号 |
H05K7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|