| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel technical method capable of manufacturing a low-resistance mounting component in a short time even on a base material having low heat resistance, in a direct circuit drawing method using particles that absorb high-frequency electromagnetic waves. SOLUTION: This thermolysis mutual fusion method for heat decomposable particles is used for selectively heating the heat decomposable particles, by performing, on various kinds of bases, surface application or circuit patterning of the particles having a heat decomposable property and capable of absorbing high-frequency electromagnetic waves, and thereafter performing high-frequency electromagnetic irradiation. Electronic mounting components such as conductive materials, conducting paths, antennas, bumps, pads and vias formed using the method are also provided. COPYRIGHT: (C)2011,JPO&INPIT
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