METHOD OF FABRICATING A ULTRA-THIN METAL PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing an ultra thin metal printed circuit board is provided to prevent the generation of cracks using a core-less carrier instead of a core. CONSTITUTION: An insulating layer(100b) is formed on the surface of a metal core. A pad is formed on the surface of a copper foil(100c) formed on the carrier. An aluminum layer is formed on the surface of the carrier through an aluminum electrolyte plating process. A patterned dry film is formed on the surface of the aluminum layer in order to selectively expose the surface of the aluminum layer. An anodic oxidation process is implemented to form a hole conductor(140a) which is in connection with the pad. A copper circuit is formed. The metal core is eliminated. The exposed copper foil is eliminated to obtain two ultra thin metal printed circuit boards.