| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component-mounted body that secures insulation between an electronic component and a substrate and also reliably joins the electronic component and substrate, and to provide a method of manufacturing the same. SOLUTION: A surface of the electronic component 1, where a stud bump 2a and a stud bump 2b are provided, is opposed to and pressed against a surface of the substrate other than a surface having a bonding pad 4a and a bonding pad 4b. Consequently, the stud bump 2a and stud bump 2b penetrate the substrate 3 and a distal end of the stud bump 2a reaches the bonding pad 4a and a distal end of the stud bump 2b reaches the bonding pad 4b, thereby electrically joining them together. COPYRIGHT: (C)2010,JPO&INPIT |
