| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component efficiently manufacturing a high-reliability electronic component with an electronic component element covered with a dense armoring resin. <P>SOLUTION: In this method of manufacturing an electronic component, an electronic component element 10 is immersed in thermosetting paste containing (a) a thermosetting resin, (b) an inorganic filler with 55-65 pts.wt. of a spherical inorganic filler and 35-45 pts.wt. of an amorphous filler mixed therein, and (c) a solvent to apply the thermosetting resin paste to the surface of the electronic component element 10; the paste is dried; thereafter an armoring resin body layer 11 is formed by heating and setting it; and resin paste for top coat is applied to the surface of the armoring resin body layer 11 to form a top coat layer 12 coating the armoring resin body layer 11. For the thermosetting resin paste, thermosetting resin paste in which the content of the inorganic filler is 75-80 wt.% is used. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
