Substrate for holding at least one component and method for producing a substrate

摘要

The substrate (1) for receiving a power semiconductor component (3), comprises a body produced from an electrically insulating material and provided with an electrically conductive layer (2) on a front side and/or an opposite rear side, where the substrate body has a matrix formed from a preceramic polymer, which is filled with a filler with a filling level of up to 95 vol.%. The filler is a powder formed from a ceramic material and having a grain size of 0.5-500 mu m. A thermal conductivity of the ceramic material at room temperature is larger than 20 W/mK. The substrate (1) for receiving a power semiconductor component (3), comprises a body produced from an electrically insulating material and provided with an electrically conductive layer (2) on a front side and/or an opposite rear side, where the substrate body has a matrix formed from a preceramic polymer, which is filled with a filler with a filling level of up to 95 vol.%. The filler is a powder formed from a ceramic material and having a grain size of 0.5-500 mu m. A thermal conductivity of the ceramic material at room temperature is larger than 20 W/mK. The electrically conductive layer is made of semiconductor, and is present in the form of a given conductive web structure. An independent claim is included for a method for producing a substrate for receiving a power semiconductor component.